002618.SZ

Shenzhen Danbond Technology Co.,Ltd. [002618.SZ] Stock Forecast

Buy or Sell ? Support and Resistance
What is MACD and how to read it?
How RSI can help?
RSI : 000

002618.SZ Stock Summary

In the News

002618.SZ Financial details

Company Rating
-
Market Cap
0
Income
-207.43M
Revenue
55.07M
Book val./share
-
Cash/share
-
Dividend
-
Dividend %
-
Employees
370
Optionable
No
Shortable
Yes
Earnings
28 Apr 2022
P/E
-3.15
Forward P/E
-
PEG
0.42
P/S
-
P/B
0.75
P/C
-
P/FCF
-
Quick Ratio
0.01
Current Ratio
0.17
Debt / Equity
-
LT Debt / Equity
-
-
-
EPS (TTM)
-0.38
EPS next Y
-
EPS next Q
-
EPS this Y
-72.97%
EPS next Y
-
EPS next 5Y
-
EPS last 5Y
NAN%
Revenue last 5Y
-18.19%
Revenue Q/Q
-73.29%
EPS Q/Q
-49.38%
-
-
-
-
SMA20
-
SMA50
-
SMA100
-
Inst Own
-
Inst Trans
-
ROA
-14%
ROE
-24%
ROC
-0.16%
Gross Margin
-68%
Oper. Margin
-127%
Profit Margin
-190%
Payout
-
Shs Outstand
-
Shs Float
-
-
-
-
-
Target Price
-
52W Range
1.17-1.28
52W High
+26%
52W Low
+26%
RSI
-
Rel Volume
3.61
Avg Volume
11.41M
Volume
41.16M
Perf Week
-
Perf Month
-
Perf Quarter
-
Perf Half Y
0%
-
-
-
-
Beta
0.066956
-
-
Volatility
0%, 0%
Prev Close
0%
Price
1.26
Change
5%

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Company Profile

Technology Hardware, Equipment & Parts

Shenzhen Danbond Technology Co.,Ltd. engages in the research, development, manufacture, and sale of flexible circuits and its materials primarily in China. The company offers FCCL single and double side substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; chip on flexible printed circuit products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and flexible printed circuit boards. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. The company was founded in 2001 and is based in Shenzhen, China. Shenzhen Danbond Technology Co.,Ltd. is a subsidiary of Shenzhen Danbang Investment Group Co., Ltd.