2354.TW

Foxconn Technology Co., Ltd. [2354.TW] Stock Forecast

Buy or Sell ? Support and Resistance
What is MACD and how to read it?
How RSI can help?
RSI : 000

2354.TW Stock Summary

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In the News

2354.TW Financial details

Company Rating
-
Market Cap
82.75B
Income
4.26B
Revenue
74.53B
Book val./share
-
Cash/share
-
Dividend
1.6
Dividend %
3.13%
Employees
46.1K
Optionable
No
Shortable
Yes
Earnings
09 May 2024
P/E
17.93
Forward P/E
-
PEG
-
P/S
0.78
P/B
0.69
P/C
-
P/FCF
8.61
Quick Ratio
2.13
Current Ratio
2.25
Debt / Equity
-
LT Debt / Equity
-
-
-
EPS (TTM)
3.02
EPS next Y
-
EPS next Q
-
EPS this Y
-0.33%
EPS next Y
-
EPS next 5Y
-
EPS last 5Y
-9.8%
Revenue last 5Y
-5.67%
Revenue Q/Q
-45.8%
EPS Q/Q
-1.32%
-
-
-
-
SMA20
-13.2%
SMA50
-22.83%
SMA100
-31.21%
Inst Own
-
Inst Trans
-
ROA
3%
ROE
4%
ROC
0.06%
Gross Margin
7%
Oper. Margin
6%
Profit Margin
4%
Payout
-
Shs Outstand
-
Shs Float
-
-
-
-
-
Target Price
-
52W Range
48.8-68.7
52W High
-13.24%
52W Low
+22.92%
RSI
46.83
Rel Volume
0.56
Avg Volume
18.81M
Volume
10.57M
Perf Week
6.69%
Perf Month
-16.55%
Perf Quarter
-26.8%
Perf Half Y
-17.83%
-
-
-
-
Beta
0.753
-
-
Volatility
0.98%, 5.9%
Prev Close
0%
Price
59
Change
-0.34%

2354.TW Financial Performance

2354.TW Dividend History

2354.TW Frequently Asked Questions

What is Foxconn Technology Co., Ltd. stock symbol ?

Foxconn Technology Co., Ltd. is a TW stock and trading under the symbol 2354.TW

What is Foxconn Technology Co., Ltd. stock quote today ?

Foxconn Technology Co., Ltd. stock price is $59 today.

Is Foxconn Technology Co., Ltd. stock public?

Yes, Foxconn Technology Co., Ltd. is a publicly traded company.

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Company Profile

Technology Computer Hardware
  • Volume Average 18.81M
  • Market Capitalization 82.75B
  • Employee 46.1K
  • CEO Mr. Han-Ming Lee
  • Headquarters New Taipei City,TW
  • IPO Date 2000-01-04
  • Website https://www.foxconntech.com.tw

Foxconn Technology Co., Ltd. manufactures, processes, and sells cases, heat dissipation modules, and consumer electronics products. It offers 3C product and alloy material. The company also engages in the research, development, manufacture, and sale of computer thermal modules, computer components, and aluminum magnesium cases; and manufacture and marketing of computer cases, new alloy materials, precision molds, electronic components, and portable computers and its components. In addition, it produces and sells aluminum alloy materials, rail vehicle components, car accessories and electronic components, structured metal products, metal containers, automobile parts, power plugs, wall sockets, and micro ribbon connectors, as well as aluminum alloy parts for automobiles and electronics. The company was founded in 1990 and is headquartered in New Taipei City, Taiwan.