4971.T

MEC Company Ltd. [4971.T] Stock Forecast

Buy or Sell ? Support and Resistance
What is MACD and how to read it?
How RSI can help?
RSI : 000

4971.T Stock Summary

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4971.T Financial details

Company Rating
-
Market Cap
69.09B
Income
2.3B
Revenue
14.02B
Book val./share
-
Cash/share
-
Dividend
45
Dividend %
1.04%
Employees
454
Optionable
No
Shortable
Yes
Earnings
08 May 2024
P/E
34.43
Forward P/E
-
PEG
-14.34
P/S
5.82
P/B
3.4
P/C
-
P/FCF
-
Quick Ratio
4.77
Current Ratio
5.57
Debt / Equity
-
LT Debt / Equity
-
-
-
EPS (TTM)
122.51
EPS next Y
-
EPS next Q
-
EPS this Y
-24.15%
EPS next Y
-
EPS next 5Y
-
EPS last 5Y
13.42%
Revenue last 5Y
5.23%
Revenue Q/Q
6.78%
EPS Q/Q
-5.22%
-
-
-
-
SMA20
-7.81%
SMA50
-27.74%
SMA100
-34.32%
Inst Own
-
Inst Trans
-
ROA
9%
ROE
10%
ROC
0.1%
Gross Margin
59%
Oper. Margin
18%
Profit Margin
17%
Payout
-
Shs Outstand
-
Shs Float
-
-
-
-
-
Target Price
-
52W Range
2430.0-4700.0
52W High
-47.85%
52W Low
+0.86%
RSI
61.37
Rel Volume
1.19
Avg Volume
109.21K
Volume
130.3K
Perf Week
22.55%
Perf Month
-10.15%
Perf Quarter
-33.12%
Perf Half Y
-32.66%
-
-
-
-
Beta
0.688
-
-
Volatility
147.1%, 213.97%
Prev Close
3.99%
Price
2451
Change
3.64%

4971.T Financial Performance

4971.T Dividend History

4971.T Frequently Asked Questions

What is MEC Company Ltd. stock symbol ?

MEC Company Ltd. is a JP stock and trading under the symbol 4971.T

What is MEC Company Ltd. stock quote today ?

MEC Company Ltd. stock price is $2451 today.

Is MEC Company Ltd. stock public?

Yes, MEC Company Ltd. is a publicly traded company.

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Company Profile

Basic Materials Chemicals - Specialty
  • Volume Average 109.21K
  • Market Capitalization 69.09B
  • Employee 454
  • CEO Mr. Kazuo Maeda
  • Headquarters Amagasaki,JP
  • IPO Date 2003-04-07
  • Website https://www.mec-co.com

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.