6271.TW

Tong Hsing Electronic Industries, Ltd. [6271.TW] Stock Forecast

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RSI : 000

6271.TW Stock Summary

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6271.TW Financial details

Company Rating
-
Market Cap
31.46B
Income
1.15B
Revenue
11.58B
Book val./share
-
Cash/share
-
Dividend
7.77
Dividend %
5.34%
Employees
3.7K
Optionable
No
Shortable
Yes
Earnings
29 Apr 2024
P/E
26.94
Forward P/E
-
PEG
-4.48
P/S
2.6
P/B
1.26
P/C
-
P/FCF
-41.71
Quick Ratio
1.89
Current Ratio
2.35
Debt / Equity
-
LT Debt / Equity
-
-
-
EPS (TTM)
5.51
EPS next Y
-
EPS next Q
-
EPS this Y
-60.23%
EPS next Y
-
EPS next 5Y
-
EPS last 5Y
1.6%
Revenue last 5Y
9.29%
Revenue Q/Q
19.01%
EPS Q/Q
73.88%
-
-
-
-
SMA20
-12.51%
SMA50
-19.15%
SMA100
-19.12%
Inst Own
-
Inst Trans
-
ROA
3%
ROE
5%
ROC
0.06%
Gross Margin
26%
Oper. Margin
15%
Profit Margin
10%
Payout
-
Shs Outstand
-
Shs Float
-
-
-
-
-
Target Price
-
52W Range
119.23077-171.5
52W High
-38.3%
52W Low
-11.34%
RSI
50
Rel Volume
0.31
Avg Volume
1.73M
Volume
542.77K
Perf Week
7.54%
Perf Month
-10.21%
Perf Quarter
-18.22%
Perf Half Y
-23.27%
-
-
-
-
Beta
1.109
-
-
Volatility
2.37%, 10.06%
Prev Close
0%
Price
105.5
Change
-1.4%

6271.TW Financial Performance

6271.TW Dividend History

6271.TW Frequently Asked Questions

What is Tong Hsing Electronic Industries, Ltd. stock symbol ?

Tong Hsing Electronic Industries, Ltd. is a TW stock and trading under the symbol 6271.TW

What is Tong Hsing Electronic Industries, Ltd. stock quote today ?

Tong Hsing Electronic Industries, Ltd. stock price is $105.5 today.

Is Tong Hsing Electronic Industries, Ltd. stock public?

Yes, Tong Hsing Electronic Industries, Ltd. is a publicly traded company.

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Company Profile

Technology Semiconductors
  • Volume Average 1.73M
  • Market Capitalization 31.46B
  • Employee 3.7K
  • CEO Mr. Chia-Shuai Chang
  • Headquarters Taipei,TW
  • IPO Date 2007-11-16
  • Website https://www.theil.com

Tong Hsing Electronic Industries, Ltd. develops, manufactures, and sells micro modules and custom semiconductor packages in Taiwan. The company provides semiconductor micro module assembly, and thick and thin film substrate foundry services. It also offers microelectronic packaging technologies, such as assembly packaging services, backend technology and others, and RF testing services. In addition, the company provides contract manufacturing services for microelectronic packaging and ceramic thick/thin film substrate fabrication. Its products are used in IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component, telecommunication power supply, laser system, high power LED, microwave, semiconductor process equipment, hybrid electric vehicles, computer peripherals, medical and network equipment, and sensor applications. The company was founded in 1974 and is headquartered in Taipei, Taiwan.